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HOME > Product > Semiconductor > Through Glass Via(TGV)

Description

ParameterTGV Standard Specification
MaterialGlass, Fused Silica etc.
Wafer Size4”, 6”, 8”, 12” etc.
Mini. THK.0.2mm(< 6”), 0.3mm(8”), 0.35mm(12”)
Mini. Dia. Via20μm
Taper3~8°
Pitch50μm, 100μm, 150μm etc.
Max. Aspect Ratio1:10
MetallizationAR film, Reflection film, Splitter film etc.

* Remark:Customized is available

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